Recent #bonding technology news in the semiconductor industry

10 months ago
1. Scientists from TU Berlin and Fraunhofer IZM have modeled the mechanical damage during the shear test to better understand the process. 2. New wire materials with an aluminum-coated copper core or aluminum-magnesium alloys are more resistant than pure aluminum wires. 3. The existing shear codes for standard thick wires cannot be directly applied to these new materials, necessitating new evaluation guidelines.
Microelectronicsbonding technologymaterial science